Applications

Adopted a three-layer electroplating technology:

2μm Red Copper Base Layer: Improves the electrical conductivity of the terminal substrate and enhances the bonding strength with the silver layer.

3μm Nickel Intermediate Layer: Isolates copper from air contact to form an anti-oxidation barrier.

3-5μm Silver Top Layer: Reduces contact resistance to 1/3 of the industry average (only 1.2mΩ), ensuring efficient and stable current transmission.
Compared to traditional single-layer silver plating, the three-layer structure increases terminal corrosion resistance by 5 times and extends service life by 3 times.

Laboratory Testing:

Salt Spray Test: No corrosion after 72 consecutive hours (industry standard: 24 hours).

Plug-in and Pull-out Test: Contact resistance increase <5% after 10,000 cycles (industry average: 15%).

Production Control:
Randomly sample 10% of each batch for X-ray plating thickness inspection to ensure precise process parameters.

Provided terminal upgrade services for the customer’s existing product line:

Compatibility Design: Fits the customer’s existing connector molds without large-scale equipment replacement.

Cost Optimization: Through process improvements, controlled three-layer electroplating costs at 1.5 times that of single-layer silver plating, with only an 8% increase in the customer’s end product price.